首页 >CA324EX/E>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
OPERATIONINSTRUCTION | COREBAICoreBai Microelectronics 芯佰微芯佰微电子(北京)有限公司 | COREBAI | ||
OPERATIONINSTRUCTION | COREBAICoreBai Microelectronics 芯佰微芯佰微电子(北京)有限公司 | COREBAI | ||
Safetyswitch,generalduty,fusible,200A,120/240VAC,3poles,30hp,solidneutral,NEMA1 | SCHNEIDERSchneider Electric 施耐德施耐德电气 | SCHNEIDER | ||
Safetyswitch,generalduty,fusible,200A,120/240VAC,3poles,30hp,solidneutral,NEMA3Rwithboltonhub | SCHNEIDERSchneider Electric 施耐德施耐德电气 | SCHNEIDER | ||
WhitetranslucenthighimpactUVstabilizedacryliclens | LUMINIS Lumins Inc. | LUMINIS | ||
WireTerminal | VCC Visual Communications Company | VCC | ||
DC-30GHz2-bitDigitalAttenuator KeyFeatures UltraWidebandPerformance LowInsertionLoss WideAttenuationRange SmallDieSize | QORVO Qorvo, Inc | QORVO | ||
QuadGroundSenseOperationalAmplifier TheCO324ismonolithicICwithfourbuilt-inoperationalamplifiersfeaturinginternalphasecompensation. Eitheradualorsinglepowersupplycanbedriven,andtheseproductscanbedrivenbyadigitalsystem5Vsinglepowersupply.Theseproductscanbeusedinawiderangeofadministrative | Ceramate Ceramate Technical | Ceramate | ||
Single-Chip1kand2kCMOSMicrocontrollers | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
SmallSignalMOSFETTransistorN-ChannelEnhancement-ModeTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize21.65x21.65MILS DieThickness9.0MILS GateBondingPadArea5.5x5.5MILS SourceBondingPadArea5.9x13.8MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-12,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central |
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