首页 >CA101AX>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
MINIATURE,REGULATEDHIGHVOLTAGEDCTODCCONVERTERS | XPPOWER XP Power Limited | XPPOWER | ||
MINIATURE,REGULATEDHIGHVOLTAGEDCTODCCONVERTERS | XPPOWER XP Power Limited | XPPOWER | ||
CCR401 | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent( | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode RoHSDevice HalogenFree IO=100mA VR=80V Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent( | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent( | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode IO=100mA VR=80V RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent( | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode LowLeakageCurrent Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurgewithstand,highreliability. Mechanicaldata Case:1206(3216)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode LowLeakageCurrent Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurgewithstand,highreliability. Mechanicaldata Case:0805(2012)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent( | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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