C2012JB1E474M技术资料参数库存现货东电化-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
C2012JB1E474M	文件：101.5 Kbytes Page：15 Pages	General Multilayer Ceramic Chip Capacitors C Series FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the main 文件：101.5 Kbytes 页数：15 Pages	TDK 东电化	TDK
C2012JB1E474K	文件：101.5 Kbytes Page：15 Pages	General Multilayer Ceramic Chip Capacitors C Series FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the main 文件：101.5 Kbytes 页数：15 Pages	TDK 东电化	TDK
C2012X5R0J226MT000N	文件：0 bytes Page：0 Pages	TDK TRAY	TDK 东电化上传：深圳特瑞杰电子有限公司	TDK
C2012X5R1H104K	文件：0 bytes Page：0 Pages	TDK SMD	TDK 东电化上传：深圳市金柏一科技有限公司	TDK
C2012X5R1V226M125AC	文件：0 bytes Page：0 Pages	TDK	TDK 东电化上传：深圳市森泰鸿科技有限公司	TDK

更多C2012JB1E474M供应商更新时间2025-10-4 15:01:00