Operate on the main AC line 100V and 200V

Operate on the main AC line 100V and 200V

文件：1.18259 Mbytes 页数：18 Pages

SANKEN

三垦

组合保险丝

方式: 平铺/侧挂两款式\n˙通过将多路保险丝集成在一起,减少零部件使用量,实现轻量化\n˙通过与蓄电池接头直接连接,减少蓄电池导线\n˙平铺适用于欧洲标准蓄电池\n˙侧挂适用于日本标准蓄电池\n部分展示,更多组合设计款式,请进一步联系\n

ZEEMAN

吉门

丝印：C105；Package：TO-92；EPITAXIAL PLANAR NPN TRANSISTOR

SWITCHING APPLICATION. INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATION. FEATURES • With Built-in Bias Resistors. • Simplify Circuit Design. • Reduce a Quantity of Parts and Manufacturing Process.

文件：401.28 Kbytes 页数：6 Pages

KECKEC(Korea Electronics)

开益禧无锡开益禧半导体有限公司

丝印：C105；Package：SOT-23(DBV)；Single 3-Input Positive-NAND Gate

1FEATURES 2• Available in the Texas Instruments NanoFree™ Package • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Provides Down Translation to VCC • Max t pd of 3.8 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Drive at 3.3 V • Ioff Supports Live Inser

文件：1.75617 Mbytes 页数：29 Pages

TI

德州仪器

丝印：C105；Package：SOT-23(DBV)；Single 3-Input Positive-NAND Gate

1FEATURES 2• Available in the Texas Instruments NanoFree™ Package • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Provides Down Translation to VCC • Max t pd of 3.8 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Drive at 3.3 V • Ioff Supports Live Inser

文件：1.75617 Mbytes 页数：29 Pages

TI

德州仪器

HelioProtection® HP15NH Photovoltaic fuse-links gPV 1500VDC

FEATURES & BENEFITS • Global acceptance • Low fault current interrupting capability • Temperature cycle withstand capability • Durable construction for enhanced system longevity • High efficiency with low power losses • Available in 3 versions: plain blade, direct mounted, direct mounted wit

文件：2.62155 Mbytes 页数：18 Pages

MERSEN

美尔森

NPN SILICON TRANSISTOR

882 Transistor Chip Manual █ Introduction to the chip Chip size: 4 inches (100mm) Chip code: C105AJ-00 Chip thickness: 240±20µm Die size: 1050×1050µm 2 Welding position size: B pole 230×230µm 2; E pole 170×170µm 2 Electrode metal: aluminum Back metal: gold

文件：28.63 Kbytes 页数：1 Pages

HUASHAN

华汕电子器件

NPN SILICON TRANSISTOR

965 Transistor Chip Manual █ Introduction to the chip Chip size: 4 inches (100mm) Chip code: C105BJ-01 Chip thickness: 240±20µm Die size: 1050×1050µm 2 Welding position size: B pole 280×345µm 2; E pole 275×415µm 2 Electrode metal: aluminum Back metal: gold

文件：32.71 Kbytes 页数：1 Pages

HUASHAN

华汕电子器件

C10507-11 series C10751 series

文件：898.1 Kbytes 页数：9 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社

Variable gain and stable detection even at high gains

文件：591.8 Kbytes 页数：5 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社