丝印：C105；Package：TO-92；EPITAXIAL PLANAR NPN TRANSISTOR

SWITCHING APPLICATION. INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATION. FEATURES • With Built-in Bias Resistors. • Simplify Circuit Design. • Reduce a Quantity of Parts and Manufacturing Process.

文件：401.28 Kbytes 页数：6 Pages

KEC

KEC(Korea Electronics)

丝印：C105；Package：SOT-23(DBV)；Single 3-Input Positive-NAND Gate

1FEATURES 2• Available in the Texas Instruments NanoFree™ Package • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Provides Down Translation to VCC • Max t pd of 3.8 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Drive at 3.3 V • Ioff Supports Live Inser

文件：1.75617 Mbytes 页数：29 Pages

TI

德州仪器

丝印：C105；Package：SOT-23(DBV)；Single 3-Input Positive-NAND Gate

1FEATURES 2• Available in the Texas Instruments NanoFree™ Package • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Provides Down Translation to VCC • Max t pd of 3.8 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Drive at 3.3 V • Ioff Supports Live Inser

文件：1.75617 Mbytes 页数：29 Pages

TI

德州仪器

Operate on the main AC line 100V and 200V

Operate on the main AC line 100V and 200V

文件：1.18259 Mbytes 页数：18 Pages

SANKEN

三垦

HelioProtection® HP15NH Photovoltaic fuse-links gPV 1500VDC

FEATURES & BENEFITS • Global acceptance • Low fault current interrupting capability • Temperature cycle withstand capability • Durable construction for enhanced system longevity • High efficiency with low power losses • Available in 3 versions: plain blade, direct mounted, direct mounted wit

文件：2.62155 Mbytes 页数：18 Pages

MERSEN

美尔森

NPN SILICON TRANSISTOR

882 Transistor Chip Manual █ Introduction to the chip Chip size: 4 inches (100mm) Chip code: C105AJ-00 Chip thickness: 240±20µm Die size: 1050×1050µm 2 Welding position size: B pole 230×230µm 2; E pole 170×170µm 2 Electrode metal: aluminum Back metal: gold

文件：28.63 Kbytes 页数：1 Pages

HUASHAN

华汕电子器件

NPN SILICON TRANSISTOR

965 Transistor Chip Manual █ Introduction to the chip Chip size: 4 inches (100mm) Chip code: C105BJ-01 Chip thickness: 240±20µm Die size: 1050×1050µm 2 Welding position size: B pole 280×345µm 2; E pole 275×415µm 2 Electrode metal: aluminum Back metal: gold

文件：32.71 Kbytes 页数：1 Pages

HUASHAN

华汕电子器件

C10507-11 series C10751 series

文件：898.1 Kbytes 页数：9 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社

Variable gain and stable detection even at high gains

文件：591.8 Kbytes 页数：5 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社

Variable gain, stable detection even at high gain

文件：510.23 Kbytes 页数：7 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

滨松光子滨松光子学株式会社