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零件编号	下载订购	功能描述/丝印	制造商上传企业	LOGO
C0402C0G1C3R6B	文件：1.3923 Mbytes Page：72 Pages	CSeriesGeneralApplication	TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司	TDK
C0402C0G1C3R6B	文件：1.3923 Mbytes Page：72 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司	TDK
C0402C0G1C3R6B	文件：1.3923 Mbytes Page：72 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司	TDK
C0402C0G1C3R6C	文件：1.3923 Mbytes Page：72 Pages	CSeriesGeneralApplication	TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司	TDK

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