Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

文件：87.62 Kbytes 页数：5 Pages

DIODES

美台半导体

SURFACE MOUNT ZENER DIODE

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

文件：156.07 Kbytes 页数：4 Pages

DIODES

美台半导体

250 mW Zener Diode 2.4 to 39 Volts

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited fou Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Rohs Compliant (PSuffix designates RoHS Compliant. See ordering information) • Halogen free av

文件：397.54 Kbytes 页数：4 Pages

MCC

200 mW Zener Diode 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

文件：282.09 Kbytes 页数：4 Pages

MCC

200mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack

文件：177.12 Kbytes 页数：3 Pages

TSC

台湾半导体

Planar Die Construction

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：88.9 Kbytes 页数：4 Pages

DIODES

美台半导体

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：78.38 Kbytes 页数：4 Pages

DIODES

美台半导体

200mW SURFACE MOUNT ZENER DIODE

Features: Power dissipation: Pd: 200mW (tamb=25°C) Forward Voltage: Vf: 0.9V Operating and storage junction temp. range: Tj, Tstg: -55°C to +150°C

文件：98.04 Kbytes 页数：3 Pages

FCI

富加宜

200 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

文件：411.49 Kbytes 页数：4 Pages

MCC

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

文件：54.91 Kbytes 页数：3 Pages

DIODES

美台半导体