SILICON PLANAR ZENER DIODES

Features • Ideally Suited for Automated Assembly Processes • Total power dissipation: max. 500 mW

文件：159.04 Kbytes 页数：2 Pages

SEMTECH_ELEC

先之科半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：703.79 Kbytes 页数：4 Pages

SY

顺烨电子

丝印：W2；Package：SOD-123；SURFACE MOUNT ZENER DIODES

FEATURES： Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：1.4586 Mbytes 页数：6 Pages

SY

顺烨电子

410mW Two Terminals SMD Zener Diodes

410mW Two Terminals SMD Zener Diodes Features • Planar Die Construction • 410mW Power Dissipation • Zener Voltage 2.4v to 51v • RoHS Compliance

文件：213.92 Kbytes 页数：4 Pages

TAITRON

丝印：W3；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.61 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：1.04594 Mbytes 页数：4 Pages

CHENDA

辰达半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：283.97 Kbytes 页数：4 Pages

CHENDA

辰达半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：284.67 Kbytes 页数：4 Pages

DSK

丝印：W2；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：2.92456 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

ZENER DIODE

SOD-123 Plastic-Encapsulate Diode ZENER DIODE FEATURES • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • High temperature soldering : 260°C / 10 seconds at terminals • Pb free product

文件：529.28 Kbytes 页数：3 Pages

YEASHIN

亚昕科技