SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

文件：54.91 Kbytes 页数：3 Pages

DIODES

美台半导体

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：78.38 Kbytes 页数：4 Pages

DIODES

美台半导体

Planar Die Construction

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：88.9 Kbytes 页数：4 Pages

DIODES

美台半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：228.63 Kbytes 页数：4 Pages

BILIN

银河微电

Surface Mount Zener Diodes

Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes

文件：48.45 Kbytes 页数：2 Pages

KEXIN

科信电子

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：666.74 Kbytes 页数：4 Pages

SY

顺烨电子

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

文件：49.55 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：666.73 Kbytes 页数：4 Pages

SHUNYE

顺烨电子

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：391.6 Kbytes 页数：4 Pages

CHENDA

辰达半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：273.07 Kbytes 页数：4 Pages

DSK