丝印：WY；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：79.14 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：WY；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：122.25 Kbytes 页数：5 Pages

DIODES

美台半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：174.63 Kbytes 页数：4 Pages

BILIN

银河微电

Surface Mount Zener Diodes

Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current

文件：50.06 Kbytes 页数：2 Pages

KEXIN

科信电子

500mW SURFACE MOUNT ZENER DIODE

500mW SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 500mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

文件：49.96 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：X1；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.61 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：1.04594 Mbytes 页数：4 Pages

CHENDA

辰达半导体

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：284.67 Kbytes 页数：4 Pages

DSK

丝印：WY；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：2.92456 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

ZENER DIODE 500mW, ZENER VOLTAGE 2.0V TO 75V

DESCRIPTION The BZT52C2V0~BZT52C75 are available in SOD-123 Package. FEATURES  Total power dissipation: Max. 500mW.  Wide zener reverse voltage range 2.0V to 75V.  Small plastic package suitable for surface mounted design.  Tolerance approximately±5  Available in SOD-123 Package M

文件：405.54 Kbytes 页数：6 Pages

AITSEMI

创瑞科技