Silicon NPN Power Transistors

DESCRIPTION • With TO-3 package • High voltage capability APPLICATIONS • For horizontal deflection output stage of CTV receivers and high voltalge, fast switching and industrial applications

文件：133.67 Kbytes 页数：3 Pages

ISC

无锡固电

Silicon NPN Power Transistor

文件：130.68 Kbytes 页数：2 Pages

NJSEMINew Jersey Semi-Conductor Products, Inc.

新泽西半导体新泽西半导体公司

Trans GP BJT NPN 60V 10A

NJS

Enhanced PowerBridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：99.15 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Enhanced isoCink??Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca

文件：150.22 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Enhanced isoCink??Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca

文件：150.22 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.9 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.9 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.72 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.72 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世威世科技公司