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BU1010

EnhancedPowerBridgeRectifiers

FEATURES •ULrecognitionfilenumberE312394 •Thinsinglein-linepackage •Glasspassivatedchipjunction •AvailableforBU-5Sleadformingoption(partnumberwith“5S”suffix,e.g.BU10065S) •Superiorthermalconductivity •Solderdip275°Cmax.10s,perJESD22-B106 •Materialcat

VishayVishay Siliconix

威世科技威世科技半导体

BU1010

EnhancedisoCink??BridgeRectifiers

FEATURES •ULrecognitionfilenumberE312394 •Thinsinglein-linepackage •Glasspassivatedchipjunction •AvailableforBU-5Sleadformingoption(part numberwith“5S”suffix,e.g.BU10065S) •Superiorthermalconductivity •Solderdip275°Cmax.10s,perJESD22-B106 •Materialca

VishayVishay Siliconix

威世科技威世科技半导体

BU1010A

EnhancedPowerBridgeRectifiers

VishayVishay Siliconix

威世科技威世科技半导体

BU1010A

EnhancedPowerBridgeRectifiers

FEATURES •ULrecognitionfilenumberE309391(QQQX2)UL1557(see*) •Thinsinglein-linepackage •AvailableforBU-5Sleadformingoption(partnumberwith“5S”suffix,e.g.BU1006A5S) •Superiorthermalconductivity •Solderdip275°Cmax.10s,perJESD22-B106 •ComplianttoRoHSDir

VishayVishay Siliconix

威世科技威世科技半导体

BU1010A

EnhancedisoCink??BridgeRectifiers

FEATURES •ULrecognitionfilenumberE312394 •Thinsinglein-linepackage •Glasspassivatedchipjunction •AvailableforBU-5Sleadformingoption(part numberwith“5S”suffix,e.g.BU1006A5S) •Superiorthermalconductivity •Solderdip275°Cmax.10s,perJESD22-B106 •Materialc

VishayVishay Siliconix

威世科技威世科技半导体

BURNDY_YF1010ID

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,10AWG,0.73L,TinPlated,Yellow,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF1010IT

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,10AWG,0.73L,TinPlated,Green,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF1010IW

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,10AWG,0.73L,TinPlated,Black,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF1010UI

CuAlloyBareFerrule,SmoothFunnelEntry,10AWG,0.39L,Seamlessbbl,TinPlated,ForUseOnCuCond.

HUBBELL

HUBBELL INCORPORATED

BXMF1010

FrequencyMultiplier(x4,x8)

APITECH

API Technologies Corp

产品属性

  • 产品编号:

    BR1010MSG-G

  • 制造商:

    Comchip Technology

  • 类别:

    分立半导体产品 > 二极管 - 桥式整流器

  • 包装:

    卷带(TR)

  • 二极管类型:

    Single Phase

  • 技术:

    标准

  • 工作温度:

    -55°C ~ 150°C(TJ)

  • 安装类型:

    通孔

  • 封装/外壳:

    4-方形,BR-6

  • 供应商器件封装:

    BR-6

  • 描述:

    BRIDGE RECT

供应商型号品牌批号封装库存备注价格
Comchip Technology
25+
4-方形 BR-6
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价
HYGROUP台产
24+
BR8
50000
询价
HYElectronicCorp
24+
NA
3000
进口原装正品优势供应
询价
HY Electronic Corp
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价
Comchip Technology
22+
BR8
9000
原厂渠道,现货配单
询价
COMCHIP
1809+
BR-8
3675
就找我吧!--邀您体验愉快问购元件!
询价
Comchip
22+
NA
18
加我QQ或微信咨询更多详细信息,
询价
24+
N/A
69000
一级代理-主营优势-实惠价格-不悔选择
询价
HYNIX
22+
MP-W
8000
原装正品支持实单
询价
HY
21+20+19+
MP-W
77
原装现货支持BOM配单服务
询价
更多BR1010MSG-G供应商 更新时间2025-7-16 14:34:00