Enhanced PowerBridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：99.15 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Enhanced isoCink??Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca

文件：150.22 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Enhanced isoCink+™ Bridge Rectifiers

UL recognition file number E312394\nThin single in-line package\nGlass passivated chip junction;

Vishay

威世科技

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.9 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.9 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.72 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cat

文件：106.72 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Enhanced isoCink??Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material c

文件：150.59 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Enhanced Power Bridge Rectifiers

FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Dir

文件：121.21 Kbytes 页数：6 Pages

VishayVishay Siliconix

威世科技

Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU1006A5S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca

文件：103.84 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技