BC817-16QC

丝印：9M；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Featuresandbenefits •Highpowerdissipationcapability •Highcurrent •Threecurrentgainselections •SuitableforAutomaticOpticalInspection(AOI)ofsolderjoint •SmallerfootprintcomparedtoconventionalleadedSMDpackages •Lowpackageheightof0.5mm •AEC-Q101qualified

BC817-16QCH-Q

45 V, 500 mA PNP general-purpose transistors

Featuresandbenefits •Highpowerdissipationcapability •Highcurrent •Threecurrentgainselections •SuitableforAutomaticOpticalInspection(AOI)ofsolderjoint •SmallerfootprintcomparedtoconventionalleadedSMDpackages •Lowpackageheightof0.5mm •High-temperatureappli

BC817-16QCH-Q

丝印：8V；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Featuresandbenefits •Highpowerdissipationcapability •Highcurrent •Threecurrentgainselections •SuitableforAutomaticOpticalInspection(AOI)ofsolderjoint •SmallerfootprintcomparedtoconventionalleadedSMDpackages •Lowpackageheightof0.5mm •High-temperatureappli

BC817-16QC-Q

丝印：9M；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Featuresandbenefits •Highpowerdissipationcapability •Highcurrent •Threecurrentgainselections •SuitableforAutomaticOpticalInspection(AOI)ofsolderjoint •SmallerfootprintcomparedtoconventionalleadedSMDpackages •Lowpackageheightof0.5mm •Qualifiedaccordingto

BC817-16QC-Q

45 V, 500 mA PNP general-purpose transistors

Featuresandbenefits •Highpowerdissipationcapability •Highcurrent •Threecurrentgainselections •SuitableforAutomaticOpticalInspection(AOI)ofsolderjoint •SmallerfootprintcomparedtoconventionalleadedSMDpackages •Lowpackageheightof0.5mm •Qualifiedaccordingto

BC817-16QC-Q

45 V, 500 mA NPN general-purpose transistors; • High power dissipation capability\n• High current\n• Three current gain selections\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• AEC-Q101 qualified\n;

NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement\n Name\n JEDEC\nVersion BC817-16QC-Q\nDFN1412D-3 MO-340CA\n SOT8009\n BC807-16QC-Q\n BC817-25QC-Q\n BC807-25QC-Q\n BC817-40QC-Q\n BC807-40QC-Q\n

BC817-16Q-7-F

45V NPN SMALL SIGNAL TRANSISTOR IN SOT23

BC817-16QBH-QZ

Package：3-XDFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS NPN 45V 0.5A DFN1110D-3

Nexperia USA Inc.

BC817-16QB-QZ

Package：3-XDFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL SIGNAL BIPOLAR IN DFN PACK

Nexperia USA Inc.

BC817-16QBZ

Package：3-XDFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS NPN 45V 0.5A DFN1110D-3

Nexperia USA Inc.