丝印：A8；Package：DFN1110D-3；45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

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45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：320.55 Kbytes 页数：14 Pages

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丝印：F6；Package：DFN1110D-3；45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

文件：315.28 Kbytes 页数：13 Pages

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45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

文件：318.49 Kbytes 页数：13 Pages

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丝印：A8；Package：DFN1110D-3；45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

文件：329.51 Kbytes 页数：14 Pages

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45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

文件：331.01 Kbytes 页数：14 Pages

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Discrete and MOSFET components, analog & logic ICs

文件：11.62183 Mbytes 页数：234 Pages

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45 V, 500 mA PNP general-purpose transistors

PNP general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n NPN complement:\n Name\n JEDEC\n Version\n BC807-16QB\n DFN1110D-3\n MO • High power dissipation capability\n• High current\n• Three current gain selections\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• AEC-Q101 qualified;

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45 V, 500 mA PNP general-purpose transistors

PNP general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n NPN complement\n Name\n JEDEC\nVersion BC807-16QBH-Q\nDFN1110D-3 MO340-BA\n • High power dissipation capability\n• High current\n• Three current gain selections\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• High-temperature applications up to 175 °C\n• Q;

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45 V, 500 mA PNP general-purpose transistors

PNP general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n NPN complement\n Name\n JEDEC\nVersion BC807-16QB-Q\nDFN1110D-3 MO340-BA\n • High power dissipation capability\n• High current\n• Three current gain selections\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• AEC-Q101 qualified;

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