首页 >B2100NAV>规格书列表
零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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2.0AHIGHVOLTAGESCHOTTKYBARRIERRECTIFIER | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
2.0ASCHOTTKYBARRIERRECTIFIER DescriptionandApplications TheB2100SAFisa2A100VsinglerectifierpackagedinthelowprofileSMAFpackage.ProvidinglowVFandexcellentreverseleakagestabilityathightemperatures,thisdeviceisidealforuseingeneralrectificationapplicationssuchas: •BoostDiode •BlockingD | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
2ASurfaceMountSchottkyBarrierRectifiers Features •Lowprofilesurfacemountedapplicationinordertooptimizeboardspace. •Lowpowerloss,highefficiency. •Highcurrentcapability,lowforwardvoltagedrop. •Ultrahigh-speedswitching. •Siliconepitaxialplanarchip,metalsiliconjunction. •LeadfreeincompliancewithE | CITCChip Integration Technology Corporation 竹懋科技竹懋科技股份有限公司 | CITC | ||
2ASurfaceMountSchottkyBarrierRectifiers Features •Lowprofilesurfacemountedapplicationinordertooptimizeboardspace. •Lowpowerloss,highefficiency. •Highcurrentcapability,lowforwardvoltagedrop. •Ultrahigh-speedswitching. •Siliconepitaxialplanarchip,metalsiliconjunction. •SuffixGindicatesHalogen-fre | CITCChip Integration Technology Corporation 竹懋科技竹懋科技股份有限公司 | CITC | ||
2ASurfaceMountSchottkyBarrierRectifiers Features •Lowprofilesurfacemountedapplicationinordertooptimizeboardspace. •Lowpowerloss,highefficiency. •Highcurrentcapability,lowforwardvoltagedrop. •Ultrahigh-speedswitching. •Siliconepitaxialplanarchip,metalsiliconjunction. •SuffixGindicatesHalogen-fre | CITCChip Integration Technology Corporation 竹懋科技竹懋科技股份有限公司 | CITC | ||
Cutler-Hammer Features,Benefits andFunctions n BothBRandCHtypebranchcircuit breakerstylesavailable. n MeetslatestNECwirebending spacerequirements. n Slottedsealingscrewsathubwith sealingprovisionprovided. n Surfaceunitsaresuppliedwith mountingtabs. n Semi-flushunitsar | EATONEaton All Rights Reserved. 伊顿伊顿公司 | EATON | ||
Built-inUnderVoltageLockoutforBothChannels | ROHMRohm 罗姆罗姆半导体集团 | ROHM | ||
Fastsoft-recoverycontrolledavalancherectifier DESCRIPTION RuggedglassSOD57package,usingahightemperaturealloyedconstruction.Thispackageishermeticallysealedandfatiguefreeascoefficientsofexpansionofallusedpartsarematched. FEATURES •Glasspassivated •Highmaximumoperatingtemperature •Lowleakagecurrent •Exc | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
HOOK-UPWIRE | GENERALGeneral Cable Technologies Corporation 通用电气公司美国通用电气公司 | GENERAL | ||
SMDSchottkyBarrierRectifier | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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