Power Assemblies

HEATSINKS Power Assemblies The current range of heatsinks is illustrated with a brief resumé of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules. All heatsinks are suitable f

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Dynex

This document is intended to provide information

Introduction This document is intended to provide information on the use of, and application hints related to, ST’s L3GD20H 3-axis digital gyroscope. The L3GD20H is a 3-axis angular rate sensor with a digital I2C/SPI serial interface standard output. The device has a full scale of ±245/±500/±20

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STMICROELECTRONICS

意法半导体

Power Assemblies

Dynex

丹尼克斯

Simple Drive Requirement, Good Thermal Performance

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A-POWER

富鼎先进电子

N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET

文件：116.47 Kbytes 页数：7 Pages

A-POWER

富鼎先进电子

N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET

文件：123.98 Kbytes 页数：7 Pages

A-POWER

富鼎先进电子