4 x 2 x 1.3 Inch Form Factor 150 W with Forced-Air Cooling

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Key features Three-axis magnetic field sensor • Ultra-Small package Wafer Level Chip Scale Package (12 pins, 0.4mm diagonal ball pitch) footprint 1.56 x 1.56 mm2, height 0.6 mm • Digital interface SPI (4-wire, 3-wire), I²C, 4, 2 interrupt pins • Low voltage operation VDD supply voltage range:

文件：8.16882 Mbytes 页数：56 Pages

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ANALOG OUTPUT DRAW-WIRE – MEASUREMENT RANGE 0 UP TO 6000 MM

文件：245.62 Kbytes 页数：3 Pages

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