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This ultrafast rectifier in the dual flag SO−8 flat lead package offers

designers a unique degree of versatility and design freedom. The two

devices are electrically independent and can be used separately, as

common cathode, as common anode or in series as a function of board

level layout. The exposed pad design provides low thermal resistance.

The clip attach design creates a package with very efficient die size to

board area ratio. While thermal performance is nearly the same as the

DPAK package height and board footprint are less than half.

特性 Features

• New Package Provides Capability of Inspection and Probe After

Board Mounting

• Low Forward Voltage Drop

• 175°C Operating Junction Temperature

• NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These are Pb−Free and Halide−Free Devices

Mechanical Characteristics:

• Case: Epoxy, Molded

• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

• Lead Finish: 100% Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements

Applications

• Excellent Alternative to DPAK in Space−Constrained Automotive

Applications

• Output Rectification in Switching Power Supplies

• Freewheeling Diode used with Inductive Loads