98AON39897E中文资料安森美半导体数据手册PDF规格书

These Schottky barrier diodes are optimized for low forward

voltage drop and low leakage current. The DSN2 (Dual Silicon

No−lead) package is a chip level package using solderable metal

contacts under the package similar to DFN style packages. The DSN

style package enables 100% utilization of the package area for active

silicon, offering a significant performance per board area advantage

compared to products in plastic molded packages. The low thermal

resistance enables designers to meet the challenging task of achieving

higher efficiency and meeting reduced space requirements.

特性 Features

 Very Low Forward Voltage Drop − 400 mV @ 10 mA

 Low Reverse Current − 0.20 A @ 10 V VR

 200 mA of Continuous Forward Current

 Power Dissipation of 312 mW with Minimum Trace

 ESD Rating − Human Body Model: Class 3B

− Machine Model: Class C

 Very High Switching Speed

 Low Capacitance − CT = 7 pF

 This is a Halide−Free Device

 This is a Pb−Free Device

Typical Applications

 LCD and Keypad Backlighting

 Camera Photo Flash

 Buck and Boost dc−dc Converters

 Reverse Voltage and Current Protection

 Clamping & Protection

Markets

 Mobile Handsets

 MP3 Players

 Digital Camera and Camcorders

 Notebook PCs & PDAs

 GPS