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TPSM5601R5HRDAR

丝印:5601R5H;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HRDAR.A

丝印:5601R5H;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HRDARG4

丝印:5601R5H;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HRDARG4.A

丝印:5601R5H;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HEXTRDAR

丝印:5601R5HEXT;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HSRDAR

丝印:5601R5HS;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HSRDAR.A

丝印:5601R5HS;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HSRDARG4

丝印:5601R5HS;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

TPSM5601R5HSRDARG4.A

丝印:5601R5HS;Package:B3QFN(RDA);TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

供应商型号品牌批号封装库存备注价格
TI
25+
N/A
7734
样件支持,可原厂排单订货!
询价
TI
25+
N/A
7786
正规渠道,免费送样。支持账期,BOM一站式配齐
询价
TI
25+
B3QFN (RDA)
6000
原厂原装,价格优势
询价
TI/德州仪器
23+
B3QFN15
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
TI
23+
QFN
5000
全新原装正品现货
询价
TI(德州仪器)
23+
标准封装
6000
正规渠道,只有原装!
询价
TI
25+
B3QFN
7468
询价
TI(德州仪器)
23+
N/A
6000
公司只做原装,可来电咨询
询价
TI(德州仪器)
23+
-
13650
公司只做原装正品,假一赔十
询价
TI
23+
NA
6800
原装正品,力挺实单
询价
更多5601R5H供应商 更新时间2026-3-18 23:00:00