BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

包装：散装 类别：风扇，热管理 热敏 - 散热器 描述：HEAT SINKS BOARD LEVEL PWR SEMI

Wakefield-Vette