首页 >235-85AB>规格书列表

型号下载 订购功能描述制造商 上传企业LOGO

235-85AB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85ABE-01

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85ABE-05

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85ABE-10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85AB-01

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85AB-05

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85AB-10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85ABG

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

235-85AB

包装:散装 类别:风扇,热管理 热敏 - 散热器 描述:HEATSINK TO-220 CLIP-ON BLK

Wakefield-Vette

Wakefield-Vette

产品属性

  • 产品编号:

    235-85AB

  • 制造商:

    Wakefield-Vette

  • 类别:

    风扇,热管理 > 热敏 - 散热器

  • 系列:

    235

  • 包装:

    散装

  • 类型:

    插件板级

  • 冷却的封装:

    TO-220

  • 连接方法:

    把紧螺栓

  • 形状:

    矩形,鳍片

  • 长度:

    0.850"(21.59mm)

  • 宽度:

    1.000"(25.40mm)

  • 鳍片高度:

    0.500"(12.70mm)

  • 不同温升时功率耗散:

    2.0W @ 40°C

  • 不同强制气流时热阻:

    6.80°C/W @ 400 LFM

  • 自然条件下热阻:

    20.00°C/W

  • 材料:

  • 材料表面处理:

    黑色阳极化处理

  • 描述:

    HEATSINK TO-220 CLIP-ON BLK

供应商型号品牌批号封装库存备注价格
Wakefield
1822
全新原装 货期两周
询价
Wakefield
2022+
1818
全新原装 货期两周
询价
WEIDMULLER
25+
连接器
963
就找我吧!--邀您体验愉快问购元件!
询价
TE
25+
51
原厂现货渠道
询价
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
询价
泰科
6435
DIP
100000
全新、原装
询价
TE/泰科
2508+
/
391805
一级代理,原装现货
询价
TE Connectivity
2406+
NA
6680
优势代理渠道,原装现货,可全系列订货
询价
泰科
25+
N/A
1969
全新原装
询价
TE
1000
只做原装,可提供样品
询价
更多235-85AB供应商 更新时间2025-12-23 16:06:00