BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

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ETCList of Unclassifed Manufacturers

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NV

TE/泰科

上传：深圳市明嘉莱科技有限公司

MSOP8

TI

德州仪器

上传：香港创芯邦电子有限公司

TSSOP8

Microch

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