Modular TPC - Computing Box Module with Intel® 6th Gen. Core™ i CPU

Features ƒ Computing Box powered by Intel® Core™ i3-6100U/i5-6300U/ i7-6600U with 8GB SODIMM ƒ Supports two independent video interfaces with picture-in-picture function and up to 100m long signal transmission distance (iLINK technology) (iLINK technology) ƒ Multiple sized front panel module

文件：563.59 Kbytes 页数：2 Pages

ADVANTECH

研华科技

Modular TPC - Computing Box Module with Intel® 8th Gen. Core™ i CPU

Features ƒ Modular Computing Box powered by 8th Gen. Intel® Core™ i3- 8145UE dual-core/i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM ƒ Dual channel memory slots support up to 32GB in total ƒ Compact, fanless embedded system with chassis grounding protectio

文件：494.23 Kbytes 页数：3 Pages

ADVANTECH

研华科技

Reel

TE Connectivity

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22*25

丰宾LP

上传：深圳市展芯盛电子有限公司

SMD

BOURNS

伯恩斯

上传：深圳市福田区飞豫电子商行