2003TPC01A中文资料研华科技数据手册PDF规格书

特性 Features

ƒ Modular Computing Box powered by 8th Gen. Intel® Core™ i3- 8145UE

dual-core/i5-8365UE quad-core/ i7-8665UE quad-core processor with

built-in 8 GB DDR4 SO-DIMM

ƒ Dual channel memory slots support up to 32GB in total

ƒ Compact, fanless embedded system with chassis grounding protection

ƒ Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)

ƒ Diverse system I/O and isolated digital I/O via iDoor technology

ƒ Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor

technology

ƒ Support TPM2.0 hardware security

ƒ Modular Front Panel modules ranging from 12.1 to 23.8 with P-CAP

multi-touch in selection (12.1 & 19 features 5-wire resistive touch)