Ideal for automated placement

FEATURES • Plastic MELF package • Ideal for automated placement • Glass passivated chip junction • Low Zener impedance • Low regulation factor • Meets MSL level 1, per J-STD-020C, LF maximum peak of 250 °C • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/

文件：95.66 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Glass Passivated Power Voltage-Regulating Diodes

FEATURES • Plastic MELF package • Ideal for automated placement • Glass passivated chip junction • Low Zener impedance • Low regulation factor • Meets MSL level 1, per J-STD-020C, LF maximum peak of 250 °C • Material categorization: for definitions of compliance please see www.vishay.com/

文件：96.94 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Glass Passivated Zeners

Features • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • For surface mount applications • Glass passivated junction • Low Zener impedance • Low regulation factor • High temperature soldering guaranteed: 250°C/10 seconds at terminals

文件：25.01 Kbytes 页数：2 Pages

VAISH

威世

ZGM130S Z-Wave 700 SiP Module

KEY FEATURES • TX power up to 14 dBm • RX sensitivity @ 100 kbps: -103.9 dBm • Range: up to 1 mile • 9.8 mA RX current at 100 kbps, GFSK, 868 MHz • 13.3 mA TX current at 0 dBm output power at 908 MHz • 0.8 μA EM4H current (128 Byte RAM retention and RTCC running from LFRCO) • 32-bit ARM®

文件：1.80858 Mbytes 页数：121 Pages

SILABS

芯科科技

ZGM130S Z-Wave 700 SiP Module

KEY FEATURES • TX power up to 14 dBm • RX sensitivity @ 100 kbps: -103.9 dBm • Range: up to 1 mile • 9.8 mA RX current at 100 kbps, GFSK, 868 MHz • 13.3 mA TX current at 0 dBm output power at 908 MHz • 0.8 μA EM4H current (128 Byte RAM retention and RTCC running from LFRCO) • 32-bit ARM®

文件：1.80858 Mbytes 页数：121 Pages

SILABS

芯科科技

ZGM130S Z-Wave 700 SiP Module

KEY FEATURES • TX power up to 14 dBm • RX sensitivity @ 100 kbps: -103.9 dBm • Range: up to 1 mile • 9.8 mA RX current at 100 kbps, GFSK, 868 MHz • 13.3 mA TX current at 0 dBm output power at 908 MHz • 0.8 μA EM4H current (128 Byte RAM retention and RTCC running from LFRCO) • 32-bit ARM®

文件：1.80858 Mbytes 页数：121 Pages

SILABS

芯科科技

ZGM230S Z-Wave 800 SiP Module

KEY FEATURES • Z-Wave connectivity • RF pin for external antenna • +14 dBm TX power • -109.8 dBm RX sensitivity @100 kbps • 32-bit ARM Cortex-M33 core at 39 MHz • 512/64 kB of Flash/RAM memory • Advanced security features • Rich set of MCU peripherals • Integrated DC-DC converter • 34 GP

文件：1.7945 Mbytes 页数：50 Pages

SILABS

芯科科技

ZGM230S Z-Wave 800 SiP Module

KEY FEATURES • Z-Wave connectivity • RF pin for external antenna • +14 dBm TX power • -109.8 dBm RX sensitivity @100 kbps • 32-bit ARM Cortex-M33 core at 39 MHz • 512/64 kB of Flash/RAM memory • Advanced security features • Rich set of MCU peripherals • Integrated DC-DC converter • 34 GP

文件：1.7945 Mbytes 页数：50 Pages

SILABS

芯科科技

ZGM230S Z-Wave 800 SiP Module

KEY FEATURES • Z-Wave connectivity • RF pin for external antenna • +14 dBm TX power • -109.8 dBm RX sensitivity @100 kbps • 32-bit ARM Cortex-M33 core at 39 MHz • 512/64 kB of Flash/RAM memory • Advanced security features • Rich set of MCU peripherals • Integrated DC-DC converter • 34 GP

文件：1.7945 Mbytes 页数：50 Pages

SILABS

芯科科技

Operating Voltage = 125 / 250Vac Operating Current = 1.0 Ampere

文件：35.29 Kbytes 页数：1 Pages

JMK