Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1.

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amkor

安靠科技

CONEXANT
TOPF144

CONEXANT

上传：深圳市易芯易电子科技有限公司

COILCRAFT
NA

COILCRAFT

上传：深圳市品优时代科技有限公司

IFLYTEK
QFP64

iflytek

科大讯飞

上传：深圳市海立辉科技有限公司