| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
X2FBGA | Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. FEATURES Cutting-edgetechnologyandexpandingpackageofferingsprovideaplatformfromprototype-toproduction Copper(Cu)wireinterconnectmethodandhigh-volumeinfrastructureatallAmkorCABGAproductionfacilities LowestcostusingAmkorstandardCABGAbillofmaterialsselection 1. | amkor Amkor Technology | amkor |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
23+ |
6000 |
代理原装正品 |
询价 | ||||
EPSON |
24+ |
con |
35960 |
查现货到京北通宇商城 |
询价 | ||
XIPOS |
专业模块 |
MODULE |
8513 |
模块原装主营-可开原型号增税票 |
询价 | ||
XIPOS |
23+ |
MODULE |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
询价 | ||
XIPOS |
23+ |
标准封装 |
5000 |
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保 |
询价 | ||
XIPOS |
12+ |
2 |
询价 | ||||
XIPOS |
2022+ |
2 |
原厂原装,假一罚十 |
询价 |
更多X2FBGA供应商
更新时间2025-5-12 10:01:00
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