| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
WSF | WIRE WOUND SMD INDUCTOR ●FEATURE 1.Varioushighpowerinductorsaresuperior tobehighsaturationforsurfacemounting ●APPLICATION 1.DC-DCconverterofportableequipment 2.DigitalCamera,PDA,MP3 3.Notebook,Camcorderandothers 4.LCDTV | AITSEMIAiT Semiconductor Inc. 創瑞科技AiT創瑞科技 | AITSEMI | |
WSF | Metal Film Resistors, Power, Surface Mount FEATURES •Moldedencapsulation •Wraparoundcompliantterminationseliminate riskofsolderfilletcracking •Solderableterminations •Excellentstabilityatdifferentenvironmental conditions •Highpowerratings(upto2W) •AEC-Q200qualified(1) •Materialcategorization: fordef | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | |
WSF | Metal Film Resistors, Power, Surface Mount | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | |
Metal Film Resistors, Power, Surface Mount FEATURES •Moldedencapsulation •Wraparoundcompliantterminationseliminate riskofsolderfilletcracking •Solderableterminations •Excellentstabilityatdifferentenvironmental conditions •Highpowerratings(upto2W) •AEC-Q200qualified(1) •Materialcategorization: fordef | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC | ||
128Kx16 SRAM/FLASH MODULE, SMD 5962-96900 s(FLASH) (FLASH FEATURES ■AccessTimesof35ns(SRAM)and70ns(FLASH) ■AccessTimesof70ns(SRAM)and120ns(FLASH) ■Packaging •66-pin,PGAType,1.075inchsquareHIP,HermeticCeramicHIP(Package400) •66-pin,PGAType,1.185inchsquareHIP,HermeticCeramicHIP(Package | WEDCWhite Electronic Designs Corporation Microsemi Corporation（上海） | WEDC |
详细参数
- 型号：
WSF
- 功能描述：
环形推拉式连接器
- RoHS：
否
- 制造商：
Hirose Connector
- 产品类型：
Connectors
- 系列：
HR10
- 触点类型：
Socket(Female)
- 外壳类型：
Receptacle
- 触点数量：
4
- 外壳大小：
7
- 安装风格：
Panel
- 端接类型：
Solder
- 电流额定值：
2 A
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
NO |
23+ |
-3 |
1042 |
优势库存 |
询价 | ||
VISHAY/DALE |
5498 |
询价 | |||||
DALE |
2021+ |
N/A |
6800 |
只有原装正品 |
询价 | ||
VISHAY |
22+ |
2800 |
原装现货!可长期供货! |
询价 | |||
WS |
22+23+ |
TO-252 |
38822 |
绝对原装正品现货,全新深圳原装进口现货 |
询价 | ||
WEDC |
18 |
QFP |
200 |
进口原装正品优势供应QQ3171516190 |
询价 | ||
VISHAY/威世 |
05+ |
SMD |
330 |
原厂原装仓库现货,欢迎咨询 |
询价 | ||
WEDC |
0320 |
HIP66 |
6000 |
绝对原装自己现货 |
询价 | ||
VISHAY/威世 |
1950+ |
98552 |
只做原装正品现货!或订货假一赔十! |
询价 | |||
WEDC |
23+ |
QFP |
66800 |
原装正品专营军工 |
询价 |
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