首页 >WSDB-753GN>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Low-CostPrecisionSensorSignalConditioner GeneralDescription TheMAX1452isahighlyintegratedanalog-sensorsignalprocessoroptimizedforindustrialandprocesscontrolapplicationsutilizingresistiveelementsensors.TheMAX1452providesamplification,calibration,andtemperaturecompensationthatenablesanoverallperformanceap | MaximMaxim Integrated Products 美信美信半导体 | Maxim | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor | ASI | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor | ASI | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor | ASI | ||
ZENERDIODECHIPS •1N746ATHRU1N759AAVAILABLEINJANHCANDJANKCPERMIL-PRF-19500/127 •1N4370ATHRU1N4372AAVAILABLEINJANHCANDJANKCPERMIL-PRF-19500/127 •ZENERDIODECHIPS •0.5WATTCAPABILITYWITHPROPERHEATSINKING •COMPATIBLEWITHALLWIREBONDINGDIEATTACHTECHNIQUES,WITHTHEEXCEPTIONOFS | CDI-DIODE Compensated Deuices Incorporated | CDI-DIODE | ||
LEADLESSPACKAGEFORSURFACEMOUNT •1N746AUR-1THRU1N759AUR-1AVAILABLEINJAN,JANTXANDJANTXVPERMIL-PRF-19500/127 •1N4370AUR-1THRU1N4372AUR-1AVAILABLEINJAN,JANTXANDJANTXVPERMIL-PRF-19500/127 •LEADLESSPACKAGEFORSURFACEMOUNT •METALLURGICALLYBONDED | CDI-DIODE Compensated Deuices Incorporated | CDI-DIODE | ||
SILICONZENERDIODES | CDIL Continental Device India Limited | CDIL | ||
PNPSILICONPLANAREPITAXIALTRANSISTORS | CDIL Continental Device India Limited | CDIL | ||
SmallSignalTransistorsPNP-HighCurrentTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize66x66MILS DieThickness7.1MILS BaseBondingPadArea7.9x7.9MILS Emitter1BondingPadArea7.9x9.5MILS Emitter2BondingPadArea7.9x9.5MILS TopSideMetalizationAl-Si-30,000Å BackSideMetalizatio | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
panelmountpiezoindicators | CUI CUI Inc. | CUI |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AMPAK |
24+ |
QFN |
36000 |
进口原装现货假一赔十 |
询价 | ||
FOXCONN |
新 |
828 |
全新原装 货期两周 |
询价 | |||
WINSEMI/稳先微 |
23+ |
DFN2x2-6L |
120000 |
原装正品现货 |
询价 | ||
PERSEMI |
23+ |
DIP |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
询价 |
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