512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC