512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES ■ Access Times of 70, 85, 100, 120ns ■ Packaging • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package 509) ■ Organized as 512Kx32, User Confi gurable as 1Mx16 or 2Mx8 ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compati

文件：266.38 Kbytes 页数：6 Pages

WEDC

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES ■ Access Times of 70, 85, 100, 120ns ■ Packaging • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package 509) ■ Organized as 512Kx32, User Confi gurable as 1Mx16 or 2Mx8 ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compati

文件：266.38 Kbytes 页数：6 Pages

WEDC

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES ■ Access Times of 70, 85, 100, 120ns ■ Packaging • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package 509) ■ Organized as 512Kx32, User Confi gurable as 1Mx16 or 2Mx8 ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compati

文件：266.38 Kbytes 页数：6 Pages

WEDC

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES ■ Access Times of 70, 85, 100, 120ns ■ Packaging • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package 509) ■ Organized as 512Kx32, User Confi gurable as 1Mx16 or 2Mx8 ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compati

文件：266.38 Kbytes 页数：6 Pages

WEDC

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES ■ Access Times of 70, 85, 100, 120ns ■ Packaging • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package 509) ■ Organized as 512Kx32, User Confi gurable as 1Mx16 or 2Mx8 ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compati

文件：266.38 Kbytes 页数：6 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC

512Kx32 3.3V SRAM MODULE

FEATURES ■ Access Times of 15*, 17, 20ns ■ Low Voltage Operation ■ Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ■ Organized a

文件：332.29 Kbytes 页数：8 Pages

WEDC