丝印：WI；Package：SOD-323；Plastic-Encapsulated Diode

FEATURES ⚫ Planar die construction ⚫ 200mW power dissipation on ceramic PBC ⚫ General purpose, medium current ⚫ AEC-Q101 qualified

文件：1.05067 Mbytes 页数：5 Pages

SY

顺烨电子

丝印：WI；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 2 Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.69 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：WI；Package：SOD-323；200mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 200mW Power Dissipation 2.4V – 75V Nominal Zener Voltage 2 Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：102.11 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：WI；Package：SOD323；Small Signal Zener Diodes

Features ● Epoxy meets UL-94 V-0 flammability rating and halogen free ● Moisture Sensitivity Level 1 ● Zener Voltage 3.6V~47V ● VZ-tolerance ±2 approximately ● Part no. with suffix “Q” means AEC-Q101 qualified Applications ● General regulation functions

文件：276.53 Kbytes 页数：5 Pages

YANGJIE

扬杰电子

丝印：WI；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.61 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：WI；Package：SOD-123；SURFACE MOUNT SILICON ZENER DIODES

FEATURES • Planar Die construction • 410mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives

文件：81.93 Kbytes 页数：5 Pages

PANJIT

強茂

丝印：WI；Package：SOD-323；Surface Mount Silicon Zener Diodes

FEATURES ● Ideally suited for automated assembly processes. ● Total power dissipation: Max. 200mW

文件：766.12 Kbytes 页数：2 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：WI；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：122.25 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：WI；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：73.25 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：WI；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：79.14 Kbytes 页数：3 Pages

DIODES

美台半导体