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WED2DL32512V25BC中文资料WEDC数据手册PDF规格书

WED2DL32512V25BC
厂商型号

WED2DL32512V25BC

功能描述

512Kx32 Synchronous Pipeline Burst SRAM

文件大小

146.53 Kbytes

页面数量

9

生产厂商 White Electronic Designs Corporation
企业简称

WEDC

中文名称

Microsemi Corporation(上海)官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-9-23 17:09:00

WED2DL32512V25BC规格书详情

DESCRIPTION

The WEDC SyncBurst - SRAM family employs high-speed, low-power CMOS designs that are fabricated using an advanced CMOS process. WEDC’s 16Mb SyncBurst SRAMs integrate two 512K x 16 SRAMs into a single BGA package to provide 512K x 32 configuration. All synchronous inputs pass through registers controlled by a positive-edge-triggered single-clock input (CLK). The synchronous inputs include all addresses, all data inputs, active LOW chip enable (CE), burst control input (ADSC) and byte write enables (BW0-3). Asynchronous inputs include the output enable (OE), clock (CLK) and snooze enable (ZZ). There is also a burst mode input (MODE) that selects between interleaved and linear burst modes. Write cycles can be from one to four bytes wide, as controlled by the write control inputs. Burst operation can be initiated with the address status controller (ADSC) input.

FEATURES

■ Fast clock speed: 200, 166, 150 & 133MHz

■ Fast access times: 2.5ns, 3.5ns, 3.8ns & 4.0ns

■ Fast OE access times: 2.5ns, 3.5ns, 3.8ns 4.0ns

■ Single +3.3V power supply (VDD)

■ Separate +3.3V or +2.5V isolated output buffer supply (VDDQ)

■ Snooze Mode for reduced-power standby

■ Single-cycle deselect

■ Common data inputs and data outputs

■ Individual Byte Write control and Global Write

■ Clock-controlled and registered addresses, data I/Os and control signals

■ Burst control (interleaved or linear burst)

■ Packaging:

• 119-bump BGA package

■ Low capacitive bus loading

产品属性

  • 型号:

    WED2DL32512V25BC

  • 制造商:

    WEDC

  • 制造商全称:

    White Electronic Designs Corporation

  • 功能描述:

    512Kx32 Synchronous Pipeline Burst SRAM

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WEDC
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