WINBOND I/O

GENERAL DESCRIPTION This data sheet covers two products: W83977F, and W83977AF whose pin assignment, and most of the functions are the same. W83977AF is an advanced version of W83977F featuring the FIR function. FEATURES General • Plug & Play 1.0A Compliant • Support 13 IRQs,

文件：1.21236 Mbytes 页数：182 Pages

WINBOND

华邦电子

Package：128-BFQFP；包装：管件 类别：集成电路（IC） 专用 描述：IC INTERFACE SPECIALIZED 128QFP

NUVOTON

新唐科技

WINBOND I/O

GENERAL DESCRIPTION The W83977ATF is an evolving product from Winbonds most popular I/O chip W83877F --- which integrates the disk drive adapter, serial port (UART), IrDA 1.0 SIR, parallel port, configurable plugand-play registers for the whole chip --- plus additional powerful features: ACPI, 80

文件：1.08871 Mbytes 页数：207 Pages

WINBOND

华邦电子

WINBOND I/O

GENERAL DESCRIPTION W83977ATF/ATG is an evolving product from Winbonds most popular I/O chip W83877F --- which integrates the disk drive adapter, serial port (UART), IrDA 1.0 SIR, parallel port, configurable plug-and-play registers for the whole chip --- plus additional powerful features: ACPI, 8

文件：1.0649 Mbytes 页数：198 Pages

WINBOND

华邦电子

WINBOND I/O

GENERAL DESCRIPTION W83977ATF/ATG is an evolving product from Winbonds most popular I/O chip W83877F --- which integrates the disk drive adapter, serial port (UART), IrDA 1.0 SIR, parallel port, configurable plug-and-play registers for the whole chip --- plus additional powerful features: ACPI, 8

文件：1.0649 Mbytes 页数：198 Pages

WINBOND

华邦电子