LPC I/O

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WINBOND

华邦电子

WINBOND I/O

GENERAL DESCRIPTION\nThe W83697SF is evolving product from Winbond's most popular I/O family. They feature a whole new interface, namely LPC (Low Pin Count) interface, which will be supported in the new generation chip set. This interface as its name suggests is to provide an economical implementati General\n· Meet LPC Spec. 1.1\n· Support LDRQ#(LPC DMA), SERIRQ (serial IRQ)\n· Include all the features of Winbond I/O W83877TF\n· Integrate Smart Card functions\n· Compliant with Microsoft PC98/PC99 Hardware Design Guide\n· Support DPM (Device Power Management), ACPI\n· Programmable configuration ;

Winbond

华邦电子

IC LPC SUPER I/O 128QFP

Winbond

华邦电子

Package：128-XFQFN；包装：管件 类别：集成电路（IC） 专用 描述：IC INTERFACE SPECIALIZED 128PQFP

NUVOTON

新唐科技

Package：128-XFQFN；包装：管件 类别：集成电路（IC） 专用 描述：IC INTERFACE SPECIALIZED 128PQFP

NUVOTON

新唐科技