丝印：W6；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 2% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.69 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：W6；Package：SOD-323；200mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 200mW Power Dissipation 2.4V – 75V Nominal Zener Voltage 2% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：102.11 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：W6；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：58.61 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：W6；Package：SOD-123；SURFACE MOUNT SILICON ZENER DIODES

FEATURES • Planar Die construction • 410mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives

文件：81.93 Kbytes 页数：5 Pages

PANJIT

強茂

丝印：W6；Package：SOD-123；SURFACE MOUNT ZENER DIODES

FEATURES： Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：1.4586 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：W6；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：73.25 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：W6；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：79.14 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：W6；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：122.25 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：W6；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：2.92456 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：W6；Package：SOD-323；SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：3.0583 Mbytes 页数：7 Pages

UNSEMI

优恩半导体