W25Q64FVTBIF中文资料华邦电子数据手册PDF规格书

FEATURES

 Family of SpiFlash Memories

– W25Q64FV: 64M-bit / 8M-byte (8,388,608)

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– QPI: CLK, /CS, IO0, IO1, IO2, IO3

 Highest Performance Serial Flash

– 104MHz Standard/Dual/Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 50MB/S continuous data transfer rate

– More than 100,000 erase/program cycles

– More than 20-year data retention

 Efficient “Continuous Read” and QPI Mode

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Quad Peripheral Interface (QPI) reduces

instruction overhead

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

 Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

– 4mA active current, <1μA Power-down (typ.)

– -40°C to +85°C operating range

 Flexible Architecture with 4KB sectors

– Uniform Sector Erase (4K-bytes)

– Uniform Block Erase (32K and 64K-bytes)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

 Advanced Security Features

– Software and Hardware Write-Protect

– Top/Bottom, 4KB complement array protection

– Power Supply Lock-Down and OTP protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

 Space Efficient Packaging

– 8-pin SOIC/VSOP 208-mil

– 8-pad WSON 6x5-mm/8x6-mm

– 8-pad XSON 4x4-mm

– 16-pin SOIC 300-mil

– 8-pin PDIP 300-mil

– 24-ball TFBGA 8x6-mm

– 16-ball WLCSP

– Contact Winbond for KGD and other options