Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

文件：310.3 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世威世科技公司

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes 页数：8 Pages

IRF

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

文件：150.39 Kbytes 页数：8 Pages

IRF

Power Bridge Rectifiers

文件：93.63 Kbytes 页数：2 Pages

Semikron

赛米控丹佛斯