ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

文件：150.39 Kbytes 页数：8 Pages

IRF

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes 页数：8 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

文件：146.94 Kbytes 页数：8 Pages

IRF

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

文件：150.39 Kbytes 页数：8 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件：157.8 Kbytes 页数：8 Pages

IRF

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes 页数：8 Pages

IRF