丝印：VCBQ；Package：SOT-23(DBV)；TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R

文件：653.85 Kbytes 页数：23 Pages

TI

德州仪器

丝印：VCBQ；Package：SOT-23(DBV)；TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R

文件：653.85 Kbytes 页数：23 Pages

TI

德州仪器

丝印：VCBQ；Package：SOT-23(DBV)；TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R

文件：653.85 Kbytes 页数：23 Pages

TI

德州仪器

丝印：VCBQ；Package：SOT-23(DBV)；TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM Classification Level 2 – Device CDM Classification Level C4B • High Speed: 4.5 ns • Rail-To-R

文件：653.85 Kbytes 页数：23 Pages

TI

德州仪器