丝印：V24；Package：SOT-23；Small Signal Zener Diodes, Dual

FEATURES • Dual silicon planar Zener diodes, common cathode • The Zener voltages are graded according to the international E24 standard. Standard Zener voltage tolerance is ± 5 . Replace “C” with “B” for 2 tolerance • The parameters are valid for both diodes in one case.VZ and Rzj of the two

文件：119.89 Kbytes 页数：8 Pages

VishayVishay Siliconix

威世科技威世科技半导体

丝印：V24；Package：DFN-2；high powered surge protection tvs array

Description The PVCOM24 is a powerful transient voltage suppressor designed to protect sensitive electronics from damage or latch-up due to EOS, lightning, CDE and ESD. This device offers board level protection with its fast response time, low operating voltage and clamping voltage. The PVCOM24

文件：547.8 Kbytes 页数：7 Pages

PROTEC

丝印：V240；Package：SOT505-2；Dual inverting buffer/line driver; 3-state

1. General description The 74LVC2G240 is a dual inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH level at pins nOE causes the outputs to assume a high-impedance OFF-state. Schmitt trigger action at all inputs m

文件：284.36 Kbytes 页数：17 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：V245-15EP；Package：TQFP；4096 × 18 DSP-SYNC™ FIRST-IN, FIRST-OUT MEMORY

1FEATURES 2• 4096 × 18-Bit Organization Array • 7.5-ns Read and Write Cycle Time • 3.3-V VCC, 5-V Input Tolerant • First-Word or Standard Fall-Through Timing • Single or Double Register-Buffered Empty and Full Flags • Easily Expandable in Depth and Width • Asynchronous or Coincident Read a

文件：574.38 Kbytes 页数：45 Pages

TI2

德州仪器

丝印：V245-15EP；Package：TQFP；4096 × 18 DSP-SYNC™ FIRST-IN, FIRST-OUT MEMORY

1FEATURES 2• 4096 × 18-Bit Organization Array • 7.5-ns Read and Write Cycle Time • 3.3-V VCC, 5-V Input Tolerant • First-Word or Standard Fall-Through Timing • Single or Double Register-Buffered Empty and Full Flags • Easily Expandable in Depth and Width • Asynchronous or Coincident Read a

文件：574.38 Kbytes 页数：45 Pages

TI2

德州仪器

丝印：V2410；Package：VSON；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.86221 Mbytes 页数：37 Pages

TI1

德州仪器

丝印：V2410；Package：VSON；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.91582 Mbytes 页数：37 Pages

TI1

德州仪器

丝印：V2410；Package：VSON；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器

丝印：V2450；Package：VSON；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.86221 Mbytes 页数：37 Pages

TI1

德州仪器

丝印：V2450；Package：VSON；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.91582 Mbytes 页数：37 Pages

TI1

德州仪器