UPA836TC数据手册Renesas中文资料规格书

描述 Description

DESCRIPTION
The UPA836TC contains one NE685 and one NE688 NPN high frequency silicon bipolar chip. NEC's new ultra small TC package is ideal for all portable wireless applications where reducing board space is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.FEATURES
• SMALL PACKAGE OUTLINE:
1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package
• LOW HEIGHT PROFILE:
Just 0.55 mm high
• FLAT LEAD STYLE:
Reduced lead inductance improves electrical performance
• TWO DIFFERENT DIE TYPES:
Q1 - Ideal oscillator transistor
Q2 - Ideal buffer amplifier transistor

特性 Features

• SMALL PACKAGE OUTLINE:
1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package
• LOW HEIGHT PROFILE:
Just 0.55 mm high
• FLAT LEAD STYLE:
Reduced lead inductance improves electrical performance
• TWO DIFFERENT DIE TYPES:
Q1 - Ideal oscillator transistor
Q2 - Ideal buffer amplifier transistor