UPA809TF中文资料瑞萨数据手册PDF规格书

DESCRIPTION

The UPA809TF contains two NE688 NPN high frequency silicon bipolar chips. NECs new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.

FEATURES

• SMALL PACKAGE OUTLINE:

SOT-363 package measures just 2 mm x 1.25 mm

• LOW HEIGHT PROFILE:

Just 0.60 mm high

• HIGH COLLECTOR CURRENT:

IC MAX = 100 mA