Surface Mount Ultrafast Rectifier

FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Compliant to RoHS directive 2002/95/EC and in acc

文件：108.8 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated pellet chip junction • Ideal for automated placement • Ultrafast recovery times for high efficiency • Low forward voltage, low power losses • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified availabl

文件：102.71 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifiers

文件：103.92 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

文件：105.3 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司