UH3D-E3SLASH9AT中文资料威世数据手册PDF规格书

FEATURES

• Low profile package

• Ideal for automated placement

• Oxide planar chip junction

• Ultrafast recovery times for high frequency

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Solder dip 260 °C, 40 s

• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in secondary rectification and freewheeling for ultrafast switching speeds of ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.

Case:DO-214AB (SMC)