UGB8JTHE3SLASH45中文资料威世科技数据手册PDF规格书

FEATURES

• Glass passivated chip junction

• Ultrafast recovery time

• Soft recovery characteristics

• Low switching losses, high efficiency

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)

• Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

  For use in high voltage and high frequency power factor correction application.