UGB8JTHE3_ASLASHP中文资料威世科技数据手册PDF规格书

• Power pack

• Glass passivated chip junction

• Ultrafast recovery time

• Soft recovery characteristics

• Low switching losses, high efficiency

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of

245 °C (for D2PAK (TO-263AB package))

• Solder dip 275 °C max., 10 s per JESD 22-B106

(for TO-220AC and ITO-220AC package)

• AEC-Q101 qualified available

- Automotive ordering code: base P/NHE3

(for ITO-220AC and D2PAK (TO-263AB package))