UCC2808A-2EP中文资料增强型产品低功率电流模式推挽 PWM数据手册TI规格书

描述 Description

The UCC2808A is a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The UCC2808A contains all of the control and drive circuitry required for off-line or dc-to-dc fixed frequency current-mode switching power supplies with minimal external parts count.
The UCC2808A dual output drive stages are arranged in a push-pull configuration. Both outputs switch at half the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to 200 ns depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle to less than 50%.
The UCC2808A family offers a variety of package options and choice of undervoltage lockout levels. The family has UVLO thresholds and hysteresis options for off-line and battery powered systems. Thresholds are shown in the ordering information table.
The UCC2808A is an enhanced version of the UCC2808 family. The significant difference is that the A versions feature an internal discharge transistor from the CS pin to ground, which is activated each clock cycle during the oscillator dead time. The feature discharges any filter capacitance on the CS pin during each cycle and helps minimize filter capacitor values and current sense delay.

特性 Features

• Controlled Baseline
• Extended Temperature Performance of –40°C to 125°C
• Enhanced Product-Change Notification
• Dual Output Drive Stages in Push-Pull Configuration
• 130-µA Typical Starting Current
• 1-mA Typical Run Current
• Operation to 1 MHz
• On-Chip Error Amplifier With 2-MHz Gain Bandwidth Product
• On Chip VDD Clamping
• Output Drive Stages Capable of 500-mA Peak-Source Current, 1-A Peak-Sink Current
† Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.